Leading-edge Technology

Ozone Gas Generating System

Features:

  • Generation of ultra-high concentration ozone gas by adopting the nitrogen non-adding method to achieve ultra-high, industry leading concentrations of 400g/m3(N)
  • Restriction in generation of metal contaminant by adopting the nitrogen non-adding method to clean ozone gas (of which nitrogen oxide generation is restricted to its ultimate limit*) and maintain the desired quality for miniaturizing the pattern and enhancing film quality.
    *Nitrogen oxide concentration 0.01ppm or less (1/10000 as comparison with our previous model)
  • Succession of unique ultra-short gap discharge technology with excellent start-up characteristics, stability and cooling efficiency.
  • Compatible to international standard and in compliance with CE marking and SEMI-S2
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H series

Generates the industry's leading super-high concentration ozone gas without using nitrogen additives predominantly for semiconductor and manufacturing processes.

P series

Generates clean ozone gas using only highly pure oxygen without nitrogen additives predominantly for semiconductor and manufacturing processes.

C series

Generates clean ozone gas suitable for semiconductor manufacturing processes

N series

Generates high concentration ozone gas using common oxygen. Main applications include semiconductor manufacturing processes, chemical processes, food manufacturing processes, and water treatment.

Ozone Water Producing System

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U series

Manufacture of clean ozone water suitable for semiconductor manufacturing processes. Main applications include semiconductor manufacturing processes and precision machine part cleaning.

 

Busbar Bonding Machine 

Features

  • Bonds lead wire to the thin plate glass directly.
  • Forms busbars without heat, solder materials, or consumables.
  • Obtains low contact resistance and improves electrical property.
  • Damages to the glass can be reduced by the original technology.

Basic Specifications

  • Automatic tension-control of lead wire.
  • Monitoring System (Manufacturing Conditions, Trace of Bonding).
  • Exchangeable tip (tool)
  • Anvil & Fixing Structure (reduces damage to the glass).

Bonding Achievements

  • Glass thickness [mm]: 0.65 ~ 4
  • Surface material of the glass
    • Raw glass
    • Thin film deposited (ITO, ZnO, Ag, Cr, Al, Ti, Ni, etc.)
  • Size of the plate glass [mm]
    • □100, □300, 500 x 1000, 600 x 1200 etc.

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